Quality Standards

Since securing lasting relationships with our clients is our primary goal, Surmotech has a Quality Management System in place and follows strict policies, processes and procedures. From quoting and development to final inspection, every product must meet rigorous criteria prior to shipment. At Surmotech, we’re continuously striving to surpass the goals we have set for ourselves as well as the expectations of our customers.

We obtained our ISO 9002:1994 certification in September 1999 and, in January 2003, recertified our Quality Management System to meet the requirements of ISO 9001:2000. The ESD control program at Surmotech complies with all the mandatory requirements of the ANSI/ESD S20.20 standard. We’re actively involved with IPC and are compliant with Restriction of Hazardous Substances (RoHS) legislation. We have specialized equipment exclusively for RoHS products—and offer a suite of services to assist our clients in becoming lead-free compliant. We proactively look for ways to secure inventory. Our KANBAN system and distributor support programs further ensure inventory will always be available. We also have bonding programs in place.

Additional Quality Standards Include:

Standard	Description
ANSI/ESD S20.20	Protection of Electrical and Electronic Part, Assemblies and Equipment
IPC-1066	Markings, Symbols and Labels for Identification of Lead-Free and Other Reportable Materials in Lead-Free Assemblies, Components and Devices
IPC-1720	Assembly Qualification Profile
IPC-1751	Generic Requirements for Declaration Process Management
IPC-1752	Materials Declaration Management
IPC-2221A	Generic Standard on Printed Board Design
IPC-4101A	Specification for Base Materials for Rigid and Multi-Layer Printed Boards
IPC-6011	Generic Performance Specification for Printed Boards
IPC-6012A	Qualification and Performance Specification for Rigid Printed Boards
IPC-7095A	Design and Assembly Process Implementation for BGAs
IPC-7351A	Generic Requirements for Surface Mount Design and Land Pattern Standard
IPC-7526	Stencil and Misprinted Board Cleaning Handbook
IPC-7711A/7721A	Rework of Electronic Assemblies; Repair and Modification of Print Boards and Electronic Assemblies
IPC-9151A	Printed Board Process Capability, Quality and Relative Reliability Benchmark Test Standard and Database
IPC-9191	General Guidelines for Implementation of Statistical Process Control (SPC)
IPC-9261	In-Process DPMO and Estimated Yield for PWAs
IPC-9850	Surface Mount Placement Equipment Characterization
IPC-A-600G	Acceptability of Printed Boards
IPC-A-610D	Acceptability of Electronic Assemblies
IPC-A-620A	Requirements and Acceptance for Cable and Wire Harness Assemblies
IPC-CM-770E	Guidelines for Printed Board Component Mounting
IPC-HDBK-830	Guidelines for Design, Selection and Application of Conformal Coatings
IPC-S-816	SMT Process Guideline and Checklist
IPC-SA-61	Post Solder Semiaqueous Cleaning Handbook
IPC-SM-782	Surface Mount Design and Land Pattern Standard
IPC-T-50G	Terms and Definitions for Interconnecting and Packaging Electronic Circuits
IPC-TM-650, 2.4.22	Test Method Manual, Bow and Twist (Percentage)
JESD97	Marking, Symbols and Labels for Identification of (Pb) Lead Free Assemblies, Components and Devices
J-STD-001D	Requirements for Soldered Electrical and Electronic Assemblies
J-STD-002B	Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
J-STD-003A	Solderability Test for Printed Boards
J-STD-004A	Requirements for Soldering Fluxes
J-STD-005	Requirements for Soldering Pastes
J-STD-006B	Requirements for Electronics Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
J-STD-020C	Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
J-STD-033A	Handling, Packaging, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
MIL-STD-130K	Identification Marking of U.S. Military Property
MIL-STD-1686C	Electrostatic Discharge Control Program for Protection of Electrical and Electronic Parts, Assemblies and Equipment