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Assembly of Printed Circuit Board (PCB) for an Industrial Application

An industrial manufacturer approached Surmotech for assembly services of a printed circuit board for use in a seismic monitoring device. The seismic monitoring device digital/analog PCB assembly had overall dimensions of 10.25 x 9.0 in. and was assembled by using surface mount technology and selective soldering with lead-free solder. Manufactured from FR4, the board consisted of 1,900 placements and 1 board panelization. The single-sided board had a package size range of 0402 and a finest pitch of 0.8 mm for type BGA and 0.6 mm for type QFP. We performed quality control processes such as automated optical inspection, x-ray inspection, and functional testing.

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  Seismic Monitoring Device
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Seismic Monitoring Device

Printed Circuit Board (PCB) Specifications

Product Description This Printed Circuit Board assembly is used within a seismic monitoring device.
Capabilities Applied/Processes Surface Mount Technology (SMT)
Selective Soldering
Overall Dimensions Board Size:
Length: 10.25"
Width: 9.0"
Board Material FR4
Board Specifications 4 Layers
Standard Vias
Single Sided
No. Of Placement: 1900
Board Panelization: 1
Component Specifications Package Size Range: 0201
Finest Pitch:
  • 0.8mm-BGA
  • 0.6mm-QFP
  • BGA
  • QFP
Solder Specifications Lead Free
Testing/inspection performed Automated Optical Inspection
X-Ray Inspection

Functional Test
Industry for Use Industrial
Product Name Seismic Monitoring Device Digital/Analog PCB Assembly
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