Assembly of Printed Circuit Board (PCB) for an Industrial Application

An industrial manufacturer approached Surmotech for assembly services of a printed circuit board for use in a seismic monitoring device. The seismic monitoring device digital/analog PCB assembly had overall dimensions of 10.25 x 9.0 in. and was assembled by using surface mount technology and selective soldering with lead-free solder. Manufactured from FR4, the board consisted of 1,900 placements and 1 board panelization. The single-sided board had a package size range of 0402 and a finest pitch of 0.8 mm for type BGA and 0.6 mm for type QFP. We performed quality control processes such as automated optical inspection, x-ray inspection, and functional testing.

As a full-service electronic contract manufacturer, we look forward to being "the manufacturing department you wish you had." Contact us for more information.