| Standard | Description |
| ANSI/ESD S20.20 | Protection of Electrical and Electronic Part, Assemblies and Equipment |
| IPC-1066 | Markings, Symbols and Labels for Identification of Lead-Free and Other Reportable Materials in Lead-Free Assemblies, Components and Devices |
| IPC-1720 | Assembly Qualification Profile |
| IPC-1751 | Generic Requirements for Declaration Process Management |
| IPC-1752 | Materials Declaration Management |
| IPC-2221A | Generic Standard on Printed Board Design |
| IPC-4101A | Specification for Base Materials for Rigid and Multi-Layer Printed Boards |
| IPC-6011 | Generic Performance Specification for Printed Boards |
| IPC-6012A | Qualification and Performance Specification for Rigid Printed Boards |
| IPC-7095A | Design and Assembly Process Implementation for BGAs |
| IPC-7351A | Generic Requirements for Surface Mount Design and Land Pattern Standard |
| IPC-7526 | Stencil and Misprinted Board Cleaning Handbook |
| IPC-7711A/7721A | Rework of Electronic Assemblies; Repair and Modification of Print Boards and Electronic Assemblies |
| IPC-9151A | Printed Board Process Capability, Quality and Relative Reliability Benchmark Test Standard and Database |
| IPC-9191 | General Guidelines for Implementation of Statistical Process Control (SPC) |
| IPC-9261 | In-Process DPMO and Estimated Yield for PWAs |
| IPC-9850 | Surface Mount Placement Equipment Characterization |
| IPC-A-600G | Acceptability of Printed Boards |
| IPC-A-610D | Acceptability of Electronic Assemblies |
| IPC-A-620A | Requirements and Acceptance for Cable and Wire Harness Assemblies |
| IPC-CM-770E | Guidelines for Printed Board Component Mounting |
| IPC-HDBK-830 | Guidelines for Design, Selection and Application of Conformal Coatings |
| IPC-S-816 | SMT Process Guideline and Checklist |
| IPC-SA-61 | Post Solder Semiaqueous Cleaning Handbook |
| IPC-SM-782 | Surface Mount Design and Land Pattern Standard |
| IPC-T-50G | Terms and Definitions for Interconnecting and Packaging Electronic Circuits |
| IPC-TM-650, 2.4.22 | Test Method Manual, Bow and Twist (Percentage) |
| JESD97 | Marking, Symbols and Labels for Identification of (Pb) Lead Free Assemblies, Components and Devices |
| J-STD-001D | Requirements for Soldered Electrical and Electronic Assemblies |
| J-STD-002B | Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires |
| J-STD-003A | Solderability Test for Printed Boards |
| J-STD-004A | Requirements for Soldering Fluxes |
| J-STD-005 | Requirements for Soldering Pastes |
| J-STD-006B | Requirements for Electronics Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications |
| J-STD-020C | Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices |
| J-STD-033A | Handling, Packaging, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices |
| MIL-STD-130K | Identification Marking of U.S. Military Property |
| MIL-STD-1686C | Electrostatic Discharge Control Program for Protection of Electrical and Electronic Parts, Assemblies and Equipment |